As part of the funding initiative of the Federal Ministry of Education and Research (BMBF) for the internationalization of top clusters, future projects and comparable networks, the ECPE – Power Electronics Cluster coordinates an international research cooperation between cluster actors and an industrial consortium around the University of Osaka in Japan. The IsoGap project is about high temperature materials and reliability testing for the new generation of wide bandgap power electronics.
In the project IsoGap the cooperation partners Conti Temic microelectronic GmbH, Rogers Germany GmbH, Plasma Parylene Systems GmbH, Zestron / Dr. OK. Wack Chemie GmbH, the Institute IALB of the University of Bremen, the Fraunhofer Institute IISB and the Cluster Power Electronics in ECPE e. V. especially for isolation systems for highly integrated wide bandgap power semiconductor modules as well as extended reliability tests.
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THIS PROJECT WAS SUCCESSFULLY COMPLETED IN NOVEMBER 2021.