The desmearing process is a part of the production of printed circuit boards.
After drilling the printed circuit boards (usually made of fibreglass-reinforced epoxy resin), residues of the board material remain at the edges of the holes. These are removed by plasma treatment.
Removal of resin smears in the borehole of multilayer printed circuit boards. The etching back produces good connections, which prevents detachment during thermal shocks.
Resin layer on the borehole inner wall
Inner wall after etching with plasma
Plasma ashing takes place in very diverse areas of analytics.
With the help of low-temperature ashing in the oxygen plasma, organic matrix can be oxidised. Plasma ashing, as a pretreatment, is suitable, among other things, for the determination of
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