Multi-layer sandwich layers, normal and (patented) thin-film process

What is a "PECVD sandwich" coating?

In an all-in-one system, the substrates are applied in any sequence using the thin-film process.

What are the advantages of multi-layer sandwich structures?

By using a multi-layer sandwich, UV and temperature problems can be improved by several factors.

In addition, the following problems:

  • growth-related defects
  • particles
  • grain boundaries
  • porosity
  • cracks during mechanical stresses (dilatory or compressive stress)

are reduced by up to 1000 times due to higher density in the surfaces.

Structured surfaces such as PCBs, wafers and sensors can be coated with this method.

Thanks to our many years of experience in the field of PECVDs and patented thin-film processes, we are happy to advise you.

To clarify further technical details, please contact us; we will be happy to consult with you.

Get in touch with us for advice

If you have any questions about our services and offers, you can use the following form! We will get back to you as soon as possible.

Plasma Parylene Systems GmbH

Dorfstr. 3, 83026 Rosenheim / Pang

Certified according to

DIN EN ISO 9001:2015
DIN EN ISO 13485:2016

© 2022 – Plasma Parylene Systems GmbH – All rights reserved.